Hygrothermal Stress Analysis for a Micro-Camera Module under the Moisture Sensitivity Level One

Zhihao Zhao,Sangpu Yang,Jun Wang

DOI: https://doi.org/10.1109/icept.2018.8480675

2018-01-01

Abstract:The hygrothermal stress analysis for a plastic micro-camera module that involved the process of moisture absorption and heat reflow was performed by finite element method. The moisture diffusion, hygroscopic swelling, thermal expansion and evaporation pressure were included in the simulations. The computational data and analysis revealed that the moisture absorption was nearly saturated after a condition of 85°C/85%RH/168h in the plastic micro-camera. In the subsequent reflow, thermal conduction and the hygrothermal stress in the plastic micro-camera were computed, which showed the hygroscopic stress was lower an order of magnitude than the thermal stress but with the similar distribution. Moreover, the evaporation pressure in the cavity of the microcamera due to the accumulated moisture in the absorption process exacerbated the stress state. Considering the internal pressure, the stress distributions under different conditions was analyzed and the possible failures were discussed.