Abstract:Advanced IC’s built with recent technology nodes take advantage of the process induced mechanical stress, which is used as one of the transistor performance boosters. Modulation of the stress level, experienced by silicon chip, has significant impact on its performance and reliability. Therefore, monitoring of this stress through wafer manufacturing and packaging process is of high importance. We have developed an in-die-embedded stress sensor, testable with standard product test that can with help measuring and monitoring stress level in the die. The sensor design was demonstrated for multiple advanced FinFET technology nodes (< 14nm). We have confirmed high sensitivity across process corners and temperature with consistent results between electrical wafer sort (EWS) and final test (FT). The results from the mechanical stress sensors indicate that the stress non-uniformity across the wafer is preserved through wafer dicing/thinning/packaging process. Statistical analysis of the sensor results enables detection of wafer patterns and outlier identification at EWS and subsequent FT after assembly enables detection of abnormal mechanical stress changes due to packaging. This mechanical stress sensor provides differentiated data for EWS, FT, and Burn-In (BI) to create product relevant screening specs for improved product reliability and can provide an early alarm for the product reliability risk due to effects such as delamination or cracks. This sensor has been implemented in the PDF Solutions’ CV Core® system which enables for in-field tracking and analyzing the sensor signals to detect and mitigate the potentially disastrous reliability failures.

Application of silicon stress sensor in flip chip packaging system

Research on Stress in Flip Chip Packaging with Silicon Piezoresistive Stress Sensor

Stress Monitoring in Flip Chip Packaging Process

Research on the Stress in Stacked Chip Packages

Study and application of piezoresistive stress test chip for IC packages

Study of Local Stress Using Stress-Absorbing Si Diaphragm

The flexible package and applications of ultra-thin sensor chip

Tracking in-die mechanical stress through silicon embedded sensors for advanced packaging applications

Design, Fabrication, and Calibration of a Piezoresistive Stress Sensor on SOI Wafers for Electronic Packaging Applications

Fabrication of ultra-thin silicon stress sensor chips with high flexibility and high sensitivity

Development of Highly-Sensitive and Ultra-Thin Silicon Stress Sensor Chips for Wearable Biomedical Applications

A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

Design of Piezoresistive Micro-Cantilever with Stress Concentration Regions

Evaluation of Die Stress in MEMS Packaging: Experimental and Theoretical Approaches

A Novel Packaging Stress Isolation Chip for MEMS Devices

[Establishment of the micro-stress sensor measurement system for invisible aligner technique]

A Nondestructive Raman Spectra Stress 2D Analysis for the Pressure Sensor Sensitive Silicon Membrane

Ultra-sensitive, Highly Reproducible Film Stress Characterization Using Flexible Suspended Thin Silicon Plates and Local Curvature Measurements

A CMOS stress sensor chip with integrated signal processing circuits

Evaluation of the Effect of Stress Relief Slots on QFN Strip Warpage Using Finite Element Analysis

A high-temperature silicon-on-insulator stress sensor