Abstract:Stacked chip packaging (3D packaging) is an effective method to increase the density of electronic packaging, due to the packaging density on an single chip has reached the limit of current packaging process. In stacked chip packaging system, additional chips are implemented on a single chip in the third dimension, thus multiply enhance the density of electronic packaging, while the packaging size in the plane remains almost the same. Comparing to normal 2D packaging, stacked packaging needs excess process to bond the added chips to the first-layer chip or the substrate. Two effective approaches are used to bond the stacked chips: one is to flip-chip bond the second chip to the pads on the back of the first-layer chip with through-silicon-vias (TSVs); the other is to bond the stacked chip to the first-layer chip with die attachment adhesive. In these processes, chips and substrates experience certain thermal procedures, and thermal stress is induced in the stacked chips. This stress may heavily affect the performance of devices and the reliability of the packaging system. In this study, silicon piezoresistive stress sensor chips are used to measure the stress distribution in stacked packaging system. Die attachment adhesive is used to achieve the 3D stacked packaging, and different stacked modes are utilized to complete the packaging process. The effect of chip size, stacked layers, stacked mode and underfill are studied, and the stress in both top chip and bottom chip are measured.

Study and application of piezoresistive stress test chip for IC packages

A Flexible Crosstalk-Free Piezoresistive Pressure Sensor Array Based on Interdigital-Electrode for High-Precision Pressure Mapping

Research on Stress in Flip Chip Packaging with Silicon Piezoresistive Stress Sensor

Design, Fabrication, and Calibration of a Piezoresistive Stress Sensor on SOI Wafers for Electronic Packaging Applications

Application of silicon stress sensor in flip chip packaging system

Design of Piezoresistive Micro-Cantilever with Stress Concentration Regions

Simulation and Fabrication of SiO2-based Piezoresistive Microbridges for Chem/biosensors

Research on the Stress in Stacked Chip Packages

A high-temperature silicon-on-insulator stress sensor

Miniature Stress Test of Miniature Components Based on Piezoresistive Stress Sensors Test Circuit

The flexible package and applications of ultra-thin sensor chip

Study of Local Stress Using Stress-Absorbing Si Diaphragm

An In-Situ Tester for Extracting Piezoresistive Coefficients.

The Effect of Shear-Stress on the Piezoresistance of Silicon

Development of MEMS-based piezoresistive 3D stress/strain sensor using strain technology and smart temperature compensation

Stress Monitoring in Flip Chip Packaging Process

Design and Optimization of SOI Piezoresistive Microcantilever Sensors for Use in Surface Stress Measurement

A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

Simulations of piezoresistive microcantilever sensors for surface stress measurements

High Temperature Silicon-on-Insulator Piezoresistive Pressure Sensitive Chip

Two-dimensional stress measurement of a micromachined piezoresistive structure with micro-Raman spectroscopy