Measurement of Thermal Stress in Cob Packaging Structures

Xiao-Yuan He,Fanxiu Chen
DOI: https://doi.org/10.1007/978-1-4020-6239-1_161
2007-01-01
Abstract:Packaging techniques is widely used in micro electro mechanical systems (MEMS). But it produce a set of failure modes due to the mechanical nature of MEMS. Although the challenges of MEMS packaging has been known for some time, little published research has been achieved to compile data and work towards meeting these challenges. Experimental data for sensors, which exploit piezoresistivity, shows that packaging affects the output of the device [l] It is therefore important to investigate the stresses arising from the packaging process.
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