Abstract:Currently, with the increasing trend towards miniaturization and thinning of semiconductor devices, ensuring product reliability has become a crucial aspect in electronic packaging. This paper specifically focuses on MEMS temperature and humidity sensors and utilizes Moldex3D software for three-dimensional mold flow simulation analysis. The purpose of the analysis is to predict the distribution of potential air traps and identify the locations of weld lines. The influence of gate location and gate quantity on process defects and reliability issues is investigated using a single-factor method. The results clearly indicate that the design of the gate system has a significant impact on the reliability of sensor packaging. The simulation results for different gate locations demonstrate that placing the gate in the middle achieves a more balanced flow of epoxy resin. However, insufficient filling pressure in this configuration may result in an increase in the occurrence of air traps and weld lines. When multiple gates are used in the simulation, it is observed that the number of air traps does not decrease with an increase in the quantity of gates. Nonetheless, multiple gates promote a more balanced resin flow, although some convergence occurs, leading to the generation of numerous air traps at the convergence points. Additionally, excessive injection pressure can cause overflow and wire shifting at the window opening of the temperature and humidity sensor. In conclusion, the design of the gate system should carefully consider the structural characteristics of the product and the transfer molding process. It is evident that the gate system design plays a crucial role in the formation of air traps and weld lines. Therefore, a rational gate system design is vital to ensure both the yield and reliability of sensor products.

Design, Test and Evaluation of a Novel Die-Attach Structure for Packaging Stress Suppression of MEMS Resonant Accelerometers

Design and Test of MEMS Resonant Accelerometer with a Novel Die-Attach Structure

Thermal stress of MOEMS Accelerometers Based on Grating Interferometric cavity

Evaluation of Die Stress in MEMS Packaging: Experimental and Theoretical Approaches

Low stress packaging of a micromachined accelerometer

Process Development of A New Tgv Interposer for Wafer Level Package of Inertial Mems Device

Finite Element Simulation on Packaging of Hinged High-G Micromachined Accelerometer

Study on the packaging technology for a high-G MEMS accelerometer

Determination of Thermally Induced Effects and Design Guidelines of Optomechanical Accelerometers

Accurate Assessment of Packaging Stress Effects on MEMS Sensors by Measurement and Sensor–Package Interaction Simulations

A Method to Evaluate the Influence of Different Substrate on Stress Mismatch Induced Deformation in MEMS Accelerometer

Temperature-Insensitive Structure Design of Micromachined Resonant Accelerometers

Investigation and experiment of high shock packaging technology for High-G MEMS accelerometer

Investigation on the effect of the packaging-induced stress on the reliability of a MEMS sensor package

Evaluation of Residual Stress in MEMS Micromirror Die Surface Mounting Process and Shock Destructive Reliability Test

Study on Package Thermal Stress of Multi-ranged Micro-accelerometer

A SOI Sandwich Differential Capacitance Accelerometer with Low-Stress Package

A Temperature-Insensitive Micromachined Resonant Accelerometer with Thermal Stress Isolation

A Novel Stress Isolation Guard-Ring Design For The Improvement Of A Three-Axis Piezoresistive Accelerometer

Thermal Stress Resistance for the Structure of MEMS-Based Silicon Differential Resonant Accelerometer

Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures