Investigation of ICP Etching Damage of InAsP/InP Strained Multiple Quantum Wells

Meng Cao,Huizhen Wu,Yanfeng Lao,Zhanchao Huang,Cheng Liu,Jun Zhang,Shan Jiang
DOI: https://doi.org/10.3969/j.issn.1674-4926.2006.01.035
2006-01-01
Abstract:To investigate the ICP etching damage to InAsP/InP strained multiple quantum wells, specially designed InAsP/InP strained multiple quantum wells (SMQWs) are grown using gas source molecular beam epitaxy and etched by an inductively coupled plasma. The depth of damage in the SMQW structure is about 40 nm after etching for 75 nm. This is determined by measuring the photo-luminescence spectra of the sample before and after etching. This result is in good agreement with the theoretical damage depth of 43.5 nm by M. Rahman's model. It is found that the defects are mainly caused by ion channeling.
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