Metallization of SMD Inductor of Ferrite Ceramics by Magnetron Sputtering

Demiao Wang,Shurong Dong,Gaochao Ren
DOI: https://doi.org/10.3969/j.issn.1672-7126.2006.z1.022
2006-01-01
Abstract:A novel technique has been developed to metallize surface of SMD inductor made of ferrite ceramics by magnetron sputtering. The adhesion at the interface of the multilayer/substrate and the high temperature welding properties of different metal film systems were studied. The results show that the sputtered multilayer, with interfacial adhesion up to 70 N, outperforms the metal films grown by either electroplating or vacuum deposition. We suggest that the Cr/NiCu/Ag multilayer, with NiCu thickness of 150-200 nm, best satisfies the stringent metallization requirements.
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