Growth of Lead-Free Welding Films on Ferrite Substrate by Magnetron Sputtering

金浩,马元远,王德苗

DOI: https://doi.org/10.13922/j.cnki.cjovst.2008.04.011

2008-01-01

Abstract:Various metallic films, including Ag, Ni, Cu, Cr and Ni-Cu alloy, were deposited by magnetron sputtering on ferrite substrates for the purpose of lead-free welding of the ferrites. The microstructures of the films and the interface were characterized with X-ray diffraction (XRD) energy dispersive spectroscopy (EDS) and metallographic microscopy. The influence of the microstructures, films thickness and interfacial adhesion of the composite films on welding was evaluated. The results show that lead-free welding of ferrites can be realized by the newly-developed technique. We found that the Cr(150 nm)/Ni-Cu(460 nm)/Ag(200 nm) multi-layers films work best for the welding. The environmental friendly welding films have an average bonding strength of 6.15 MPa, and a welding acceptability over 98% with performance better than that of all the electroplating. In addition, it can withstand the soakage of lead-free solder at 450 °C for 10 s.