Study of MEMS packaging technology

Yufeng Zhang,XiaoYun Tan,Weiping Chen,Guowei Zhang,Xiaowei Liu
DOI: https://doi.org/10.1109/ICEPT.2005.1564712
2005-01-01
Abstract:This paper will describe the status and effects of packaging in the MEMS devices. It is pointed out that there are several marked characteristics in the MEMS differences with compare with that of IC packaging. Meanwhile it presents several methods and developing trends of MEMS packaging with the particular emphasis on analysis of its applications, including the packaging means and testing results after packaging of microaccelerometers, acoustic-vibration sensors and other MEMS devices. Some useful thoughts are also obtained. Finally the existing problems and the future directions of MEMS packaging technology are discussed. © 2005 IEEE.
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