Electron Field Emission from SiC∕Si Heterostructures by High Temperature Carbon Implantation into Silicon

YM Xing,JH Zhang,WW Yang,YH Yu,ZR Song,ZX Lin,DS Shen
DOI: https://doi.org/10.1063/1.1767958
IF: 4
2004-01-01
Applied Physics Letters
Abstract:A high-intensity electron field emission was obtained from a SiC∕Si heterostructure, which was formed by high temperature carbon implantation into silicon. Densely distributed sharp tips were easily obtained at the interface of the SiC∕Si heterostructure by post-implantation etching off the top Si. A low turn-on field of 2.6V∕μm was observed with samples formed by 160keV carbon implantation with a dose of 8.0×1017cm−2. The existence of the densely distributed small protrusions was considered as the main reason for efficient emission.
What problem does this paper attempt to address?