VLSI Thermal Placement Optimization Using Simulated Annealing

王乃龙,戴宏宇,周润德
DOI: https://doi.org/10.3969/j.issn.1674-4926.2003.04.019
2003-01-01
Abstract:A placement scheme that considers both electrical performance requirements and thermal behavior for high-performance VLSI chips was described. It is aimed at improving the substrate thermal distribution of a chip design without worsening the traditional design objects such as critical path delay and wire length very much. A useful placement method is developed using simulated annealing algorithm to optimize chip substrate thermal distribution. The simulation results show the improvement of thermal distribution over the traditional placement algorithm with the increase of less than 4% in delay and total wire length of the final layout.
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