Abstract:Thermal issues are a primary concern in the three-dimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized during 3D floorplanning, significantly increasing optimization complexity. Most existing floorplanners use combinatorial stochastic optimization techniques, hampering performance and scalability when used for 3D floorplanning. In this work, we propose and evaluate a scalable, temperature-aware, force-directed fioorplanner called 3D-STAF. Force-directed techniques, although efficient at reacting to physical information such as temperature gradients, must eventually eliminate overlap. This can cause significant displacement when used for heterogeneous blocks. To smooth the transition from an unconstrained 3D placement to a legalized, layer-assigned floorplan, we propose a three-stage force-directed optimization flow combined with new legalization techniques that eliminate white spaces and block overlapping during multi-layer floorplanning. A temperature-dependent leakage model is used within 3D-STAF to permit optimization based on the feedback loop connecting thermal profile and leakage power consumption. 3D-STAF has good performance that scales well for large problem instances. Compared to recently published 3D floorplanning work, 3D-STAF improves the area by 6%, wire length by 16%, via count by 22%, peak temperature by 6% while running nearly 4times faster on average.

A VLSI Floorplanning Algorithm Based on Weight

Floorplanning of VLSI by Mixed-Variable Optimization

VLSI Floorplan Based on Less Flexibility First Principle and Linear Programming

A Comparison of Less Flexibility First Principles with Simulated Annealing

Thermal-Aware Non-slicing VLSI Floorplanning Using a Smart Decision-Making PSO-GA Based Hybrid Algorithm

Weight-Based Fpga Placement Algorithm With Wire Effect Considered

A thermal-driven force-directed floorplanning algorithm for 3D ICs

A Parallel Vlsi Floorplanning Algorithm Using Corner Block List Topological Representation

Integrated floorplanning and power supply planning

An Analytical Approach to Incremental Floorplanning

Simultaneous Optimization Of Performance And Thermal Effects Based On Two-Stage Microarchitectural Floorplanning

A Novel Incremental Algorithm For Non-Slicing Floorplan With Low Time Complexity

Multi-Objective Optimization in 3D Floorplanning

Hybrid Algorithm for Floorplanning Using B*-tree Representation

Hierarchical 3-D Floorplanning Algorithm for Wirelength Optimization.

2.5d Floorplan Based Annealed Neural Networks For Circuit Partitioning

Large Scale VLSI Module Placement Using LFF Heuristics by Stages

A Novel Mixed-Size Fixed-Outline Floorplacement Algorithm

3D-STAF: Scalable Temperature and Leakage Aware Floorplanning for Three-Dimensional Integrated Circuits

Optimizing Wirelength And Delay of FPGA Tile through Floorplanning Based on Simulated Annealing Algorithm.

A Thermal Aware Floorplanning Algorithm Supporting Voltage Islands for Low Power SOC Design.