Abstract:Floorplanning is an important physical design step in the ASIC design flow. It is the process of estimating the area to be occupied by various blocks in a layout together with a precise interconnection pattern. In this work, a smart decision-making hybrid particle swarm optimization-genetic algorithm that aims at reducing the area, wirelength, and hotspot by distributing the temperature evenly across the chip is presented. B*-tree is used to generate the initial floorplan and later a PSO-GA based hybrid algorithm is used to obtain an optimal placement solution. Temperature-driven floorplanning is considered at the perturbation stage to separate the hotspots, thereby reducing the average and maximum temperature. The experimental results of the proposed algorithm are compared with other stochastic algorithms using MCNC and Alpha processor floorplan benchmark circuits. The result shows that the proposed algorithm performs efficient floorplanning, with reduced average and peak temperature.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is in VLSI (Very - Large - Scale Integration) design, how to effectively manage the chip temperature and avoid the formation of hotspots while reducing the chip area and wirelength. Specifically, the paper proposes a PSO - GA based hybrid algorithm, aiming to achieve the above - mentioned goals through non - slicing floorplanning. This method not only considers the optimal placement of modules to reduce the area and wirelength, but also introduces a thermal - aware design strategy to reduce the average and peak temperatures of the chip by evenly distributing heat, thereby improving the performance, reliability and energy efficiency of the chip. The main contributions of the paper are as follows: 1. **Multi - objective optimization**: A hybrid algorithm that can simultaneously optimize the area, wirelength and temperature is proposed. 2. **Thermal - aware floorplanning**: The concept of thermal management is introduced during the floorplanning process, and hotspots are dispersed by adjusting the positions of modules to reduce the overall temperature. 3. **Efficient search strategy**: Combining the advantages of PSO and GA, it can find better solutions in a larger search space and avoid falling into local optimal solutions. 4. **Experimental verification**: By comparing with a variety of existing random algorithms, the effectiveness of the proposed algorithm is proved, especially when dealing with MCNC and Alpha processor benchmark circuits. In general, by proposing an innovative thermal - aware non - slicing floorplanning method, this paper solves the key challenges in VLSI design, that is, effectively managing the chip temperature while optimizing the area and wirelength, which is of great significance for improving the performance and reliability of modern integrated circuits.

Thermal-Aware Non-slicing VLSI Floorplanning Using a Smart Decision-Making PSO-GA Based Hybrid Algorithm

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