Abstract:Abstract3D integration is one of the scalable multiprocessor design solutions. The main challenge in 3D design is temperature traps, especially in the upper layers and hot spots. The current studies present solutions for solving temperature and hotspot problems in topology, routing, and mapping levels. Accordingly, the characteristics of temperature-aware core mapping are beneficial for dealing with the challenges of 3D chips. In this paper, the core temperature is modeled based on processing, communication power, neighbor node temperature, distance from the heat sink, and hotspot node. To find the optimal solution, this paper proposes thermal-aware application mapping techniques using genetic algorithms and fuzzy logic to minimize peak temperatures in 3D network-on-chip (NoC) architectures. Fitness functions include the above parameters with the same weight (GSM) and the fitness function with fuzzy logic by considering the effect of distance from heat sink (GFM1) and heat sink distance and the number of neighbor’s core (GFM2). Specifically, the fuzzy logic-based GFM1 algorithm demonstrates superior performance over the genetic algorithm-driven GSM approach in reducing power consumption and energy costs associated with inter-core communication traffic. Across the different traffic patterns tested, GFM1 consistently achieves lower energy expenditure, with reductions upward of 50% compared to GSM. This underlines the strengths of the fuzzy technique in enabling thermal-aware mapping to minimize chip temperatures in the presence of intensive workloads and communication. In essence, the key takeaway is that GFM1 outperforms GSM in the context of power and energy metrics linked to handling on-chip traffic between processing cores.

Thermal-Aware Floorplanning Considering Empty Space Effect Based On Genetic Algorithms

Power-and thermal-aware mapping for NoC under latency constraint

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation.

Hierarchical Thermal Model Using Gauss-Seidel Method in Floorplanning

A Novel Thermal Optimization Flow Using Incremental Floorplanning for 3D ICs

Thermal Effects with Leakage Power Considered in 2D/3D Floorplanning

An Efficient Thermal Optimization Flow Using Incremental Floorplanning For 3d Microprocessors

A thermal-driven force-directed floorplanning algorithm for 3D ICs

Simultaneous Optimization Of Performance And Thermal Effects Based On Two-Stage Microarchitectural Floorplanning

Thermal-Aware Non-slicing VLSI Floorplanning Using a Smart Decision-Making PSO-GA Based Hybrid Algorithm

Fast power density aware three‐dimensional integrated circuit floorplanning for hard macroblocks using best operator combination genetic algorithm

Thermal-aware application mapping using genetic and fuzzy logic techniques for minimizing temperature in three-dimensional network-on-chip

Efficient Thermal-Oriented 3D Floorplanning and Thermal Via Planning for Two-Stacked-die Integration

Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization

3D-STAF: Scalable Temperature and Leakage Aware Floorplanning for Three-Dimensional Integrated Circuits

Integrating Dynamic Thermal Via Planning with 3D Floorplanning Algorithm.

Thermal-Aware 3d Floorplan

Thermal Via Planning Aware Force-Directed Floorplanning for D ICs

RLPlanner: Reinforcement Learning based Floorplanning for Chiplets with Fast Thermal Analysis

Thermal-Aware Task Placement with Dynamic Thermal Model in an Established Datacenter

Thermal-Aware Task Scheduling for 3D Multicore Processors.