Abstract:In 3D IC design, thermal issue is a critical challenge. To eliminate hotspots, physical layouts are always adjusted by some incremental changes, such as shifting or duplicating hot blocks. In this paper, we distinguish the thermal-aware incremental changes in three different categories: migrating computation, growing unit and moving hotspot blocks. However, these modifications may degrade the packing area as well as interconnect distribution greatly. In this paper, mixed integer linear programming (MILP) models are devised according to these different incremental changes so that multiple objectives can be optimized simultaneously. Furthermore, to avoid random incremental modification, which may be inefficient and need long runtime to converge, here potential gain is modeled for each candidate incremental change. Based on the potential gain, a novel thermal optimization flow to intelligently choose the best incremental operation is presented. Experimental results show that migrating computation, growing unit and moving hotspot can reduce max on-chip temperature by 7%, 13% and 15% respectively on MCNC/GSRC benchmarks. Still, experimental results also show that the thermal optimization flow can reduce max on-chip temperature by 14% to the initial packings generated by an existing 3D floorplanning tool CBA, and achieve better area and total wirelength improvement than individual operations do. The results with the initial packings from CBA_T (Thermal-aware CBA floorplanner) show that 13.5% temperature reduction can be obtained by our incremental optimization flow.

Hierarchical Thermal Model Using Gauss-Seidel Method in Floorplanning

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation.

Thermal-Aware Floorplanning Considering Empty Space Effect Based On Genetic Algorithms

A Novel Thermal Optimization Flow Using Incremental Floorplanning for 3D ICs

A thermal-driven force-directed floorplanning algorithm for 3D ICs

Integrating Dynamic Thermal Via Planning with 3D Floorplanning Algorithm.

Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization

An Efficient Thermal Optimization Flow Using Incremental Floorplanning For 3d Microprocessors

A layout-to-simulation approach for thermal design of IC

Efficient Thermal-Oriented 3D Floorplanning and Thermal Via Planning for Two-Stacked-die Integration

THERMAL TOPOLOGY OPTIMIZATION DESIGN OF SPINDLE STRUCTURE WITH A HYBRID CELLULAR AUTOMATON METHOD

Simultaneous Optimization Of Performance And Thermal Effects Based On Two-Stage Microarchitectural Floorplanning

Parallel Space Adaptive Multigrid Method for IC Thermal Analysis

Efficient Thermal Via Planning Approach and Its Application in 3-D Floorplanning

Thermal Topology Optimization Design Method of Spindle under Temperature-Structure Field Coupling Condition Based on Irregular Cell

Thermal Via Planning Aware Force-Directed Floorplanning for D ICs

Thermal-Aware 3d Floorplan

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

Efficient Hierarchical Algorithm for Mixed Mode Placement in Three Dimensional Integrated Circuit Chip Designs

Efficient Thermal Analysis Method for Large Scale Compound Semiconductor Integrated Circuits Based on Heterojunction Bipolar Transistor

Fast power density aware three‐dimensional integrated circuit floorplanning for hard macroblocks using best operator combination genetic algorithm