Abstract:The very large scale integration (VLSI) chip design includes a crucial phase called floorplanning. Several nature-inspired metaheuristic algorithms were developed depending on swarm intelligence for VLSI floorplanning. But, the energy consumption and heat generation of floorplanning in VLSI design were not improved using existing metaheuristic algorithms. In order to improve the performance of floorplanning with minimum energy consumption and heat generation, multi-objective firefly optimization-based floorplanning (MOFO-FP) technique is introduced. The main aim of MOFO-FP technique is to reduce the heat generation, space occupied and wire length with the fixed outline constraints for VLSI floorplanning. After constructing the floorplan design, optimization is performed using energy and heat-aware firefly optimization (EHAFO) algorithm. In EHAFO algorithm, the multi-objective function such as heat generation, space occupied and wire length is calculated for efficient floorplanning in VLSI design. Based on the objective functions, the light intensity of each firefly is calculated. From that, the lower brightness fireflies are moved towards higher brightness firefly to identify the optimized position. Lastly, the ranking process carried out to rank the fireflies depends on the intensity to find the optimal tree structure for VLSI floorplanning. This, in turns, proposed MOFO-FP technique which reduces the energy consumption, wire length and heat generation. Experimental evaluation of MOFO-FP technique is carried out with the performance metrics such as wirelength, heat generation, and space consumption compared to the state-of-the-art works. The results are observed that the MOFO-FP technique reduces the space occupied by the circuits with minimum heat generation as well as wire length than the state-of-the-art methods.

Simultaneous Optimization Of Performance And Thermal Effects Based On Two-Stage Microarchitectural Floorplanning

Power-and thermal-aware mapping for NoC under latency constraint

An Efficient Thermal Optimization Flow Using Incremental Floorplanning For 3d Microprocessors

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation.

Efficient Thermal-Oriented 3D Floorplanning and Thermal Via Planning for Two-Stacked-die Integration

A Novel Thermal Optimization Flow Using Incremental Floorplanning for 3D ICs

Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization

A Thermal Aware Floorplanning Algorithm Supporting Voltage Islands for Low Power SOC Design.

Thermal-Aware Non-slicing VLSI Floorplanning Using a Smart Decision-Making PSO-GA Based Hybrid Algorithm

3D-STAF: Scalable Temperature and Leakage Aware Floorplanning for Three-Dimensional Integrated Circuits

Investigating the Effects of Fine-Grain Three-Dimensional Integration on Microarchitecture Design

Integrating Dynamic Thermal Via Planning with 3D Floorplanning Algorithm.

Thermal-Aware Floorplanning Considering Empty Space Effect Based On Genetic Algorithms

Thermal Layout Optimization for 3D Stacked Multichip Modules.

A thermal-driven force-directed floorplanning algorithm for 3D ICs

RLPlanner: Reinforcement Learning based Floorplanning for Chiplets with Fast Thermal Analysis

Multi-Objective Optimization in 3D Floorplanning

3D architecture modeling and exploration

Multi-objective optimization for energy and heat-aware VLSI floorplanning using enhanced firefly optimization

Thermal Effects with Leakage Power Considered in 2D/3D Floorplanning

Layout-Dominated Electro-Thermal Optimization for Multichip Power Modules with Response Surface and Fourier Series Model