Abstract:Abstract The semiconductor packaging technologies have seen its growth from multichip module (MCM), system in package (SiP), system on chip (SoC) to the heterogeneous integration of the MCM. Thermal management of multichip vertically integrated systems poses additional constraints and limitations beyond those for single chip modules. Three-dimensional-integrated circuits (3D ICs) technology is a potential approach for next-generation semiconductor packaging technologies. A 3D IC is formed by vertical interconnection of multiple substrates containing active devices which offer reduced die footprint and interconnect length. This paper discusses the optimal arrangement of two hotspots on each layer of a two-die stacked 3D IC. An analytical heat transfer model for prediction of three-dimensional temperature field of a 3D IC based on the solution of governing energy equations has been developed and used for this study. The model is subject to adiabatic boundary conditions at the walls except for the bottom wall which is subject to convective boundary condition. A feed-forward back propagation artificial neural network (ANN) is employed for obtaining the functional relationship between the location of the hotspots and the objectives. Genetic algorithm is employed for solving two nonconflicting objective functions subject to set of constraints. The first objective aims to minimize the maximum temperature on both layers, and the second objective aims to achieve temperature uniformity in the layers. The results of the optimization study are expected to provide recommendations on the design guidelines for arranging hotspots on vertically stacked substrates.

An ILP algorithm for voltage-island generation considering temperature in 3D-Ics

Thermal-Aware Post Layout Voltage-Island Generation for 3D ICs

A Thermal Aware Floorplanning Algorithm Supporting Voltage Islands for Low Power SOC Design.

A Novel Thermal Optimization Flow Using Incremental Floorplanning for 3D ICs

A Thermal-Aware Ilp-Based Algorithm In Behavioral Synthesis

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation.

Optimization of 3D IC Routing Based on Thermal Equalization Analysis

Voltage Island Aware Incremental Floorplanning Algorithm Based on MILP Formulation

Voltage Island Generation in Cell Based Dual-Vdd Design.

A thermal-driven force-directed floorplanning algorithm for 3D ICs

NBTI and Leakage Reduction Using an Integer Linear Programming Approach

Thermal aware placement in 3D ICs using quadratic uniformity modeling approach

LP Based White Space Redistribution for Thermal Via Planning and Performance Optimization in 3D ICs

A Fast and Low Computation Consumption Model for System-Level Thermal Management in 3D IC

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

An Analytical Placement Framework for 3-D ICs and Its Extension on Thermal Awareness

Thermal-aware Cell and Through-Silicon-via Co-Placement for 3D ICs.

Three-dimensional Multiprocessor System-on-chip Thermal Optimization

Lagrangian Relaxation Based Inter-Layer Signal Via Assignment For 3-D Ics

Practically Scalable Floorplanning with Voltage Island Generation

Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization