Abstract:Using the complex image method (CIM), we have analyzed the frequency and temperature dependencies of substrate eddy currents for single-ended and differential spiral inductors on a lossy silicon substrate. From our analysis, we have derived a set of accurate closed-form expressions for calculating inductances and substrate losses due to substrate eddy currents. Here, we propose a frequency-dependent eleven-element equivalent circuit model based on these formulas. We established the validity of the model by comparing the simulated and measured results, which are in good agreement. Index Terms—Complex image method (CIM), differential inductor, eddy currents, greenhouse algorithm, inductor model. HE high operating frequencies, at which deep submicrom- eter and nano-scale CMOS devices are able to operate, have brought radio-frequency integrated circuits (RFICs) in the realm of CMOS making the quality factor of the on-chip spiral inductors a focus of intense research. The quality factor of the on-chip inductor is limited by the losses due to the finite conduc- tivity of the metal and the conducting silicon substrate. Non-per- fect metal wires used to form spiral inductors cause ohmic loss due to the non-zero resistance at low frequencies. Additionally the non-uniform current distribution in metal wires at high fre- quencies increases the losses and degrades the quality factor of inductors. This loss mechanism has been extensively studied as skin- and proximity-effect (1)-(12).

Analysis of 3D-Substrate Coupling in RF- MEMS Inductors by Extended PEEC

Capacitance Extraction of Three-Dimensional Interconnects Using Element-By-Element Finite Element Method (Ebe-Fem) and Preconditioned Conjugate Gradient (pcg) Technique

Time Domain Integral Equation Method Using FFT-based Marching-on-in-degree Method for Analyzing PEC Patches on Substrate (Invited)

Analysis of Frequency- and Temperature-Dependent Substrate Eddy Currents in On-Chip Spiral Inductors Using the Complex Image Method

Characterization Of Near-Field Coupling Effects From Complicated Three-Dimensional Structures In Rectangular Cavities Using Fast Integral Equation Method

Enhancement of quality factor in RF-MEMS spiral inductors by etching out substrate

Finite Element Simulation of Electromagnetic Properties of Ferrite Material

An Efficient PEEC-Based Method for Full-Wave Analysis of Microstrip Structures

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

Development of a Novel FDTD (2, 4)-Compatible Conformal Scheme for Electromagnetic Computations of Complex Curved PEC Objects

A derived circuit model for spiral inductors on lossy silicon substrate

Calculation of RF-MEMS Inductors Using Partial Element Equivalent Circuits

A Novel Accurate PEEC‐based 3D Modeling Technique for RF Devices of Arbitrary Conductor‐magnet Structure

L-Simulator: A Magpeec-Based New Cad Tool for Simulating Magnetic-Enhanced Ic Inductors of 3d Arbitrary Geometry

Simulation and Design of 3d Geometric Rf Ic Inductors by Novel Modeling Tecniques with Magpeec Plus Fastcap (invited Paper)

PEEC Modeling and Model Order Reduction of Magnetically Enhanced Planar Inductive Device

Investigation of Power Distribution Planes with Multi-Slots Using Plane-pair PEEC Method

Analysis of Multilayer Structure Near- and Far-Field Radiation by the Coupled PP-PEEC and Field-Equivalence Principle Method

A PEEC-Based Concise Broadband Physical Circuit Modeling Method with Parameter Extraction for PCB Inductive Components

Analysis and Visualization of Magnetic Field for Multi-dimensional Helmholtz Coils Based on PEEC

Efficient Impedance Calculation for RF CMOS Spiral Inductors Incorporating Eddy Currents Effect