Abstract:This article introduces an efficient method for the equivalent circuit characterization and full-wave analysis of microstrip structures, leveraging the full-wave partial element equivalent circuit (PEEC). In particular, the multilayered Green's function is evaluated using the discrete complex-image method (DCIM) and employed to establish the mixed potential integral equations. The proposed strategy considers time delays for the retarded electric and magnetic couplings, offering a new efficient full-wave approach to extract equivalent circuit components, which encapsulate the contributions of the quasi-static, surface-wave, and complex images. It is noted that the proposed full-wave PEEC strategy allows each component contribution derived from DCIM to be efficiently represented as frequency-independent lumped circuit elements and corresponding frequency factors, thereby simplifying the extraction process of the entire frequency-dependent lumped elements in the traditional PEEC method. Moreover, the proposed PEEC model, equipped with full-wave equivalent circuits, offers clear physical insight into electromagnetic behaviors, thereby facilitating design and optimization. Finally, the accuracy and efficiency of the proposed PEEC model are fully demonstrated through various examples and experiments.

Analysis of Multilayer Structure Near- and Far-Field Radiation by the Coupled PP-PEEC and Field-Equivalence Principle Method

Efficient Calculation of Near-Field from PDN Using Equivalent Magnetic Current Modal

Characterization Of Near-Field Coupling Effects From Complicated Three-Dimensional Structures In Rectangular Cavities Using Fast Integral Equation Method

An Efficient PEEC-Based Method for Full-Wave Analysis of Microstrip Structures

Investigation of Power Distribution Planes with Multi-Slots Using Plane-pair PEEC Method

Analysis of Multilayer Planar Circuits by a Hybrid Method

Plane-pair PEEC method for impedance analysis of multi-slots power distribution network with experimental validation

Radiation Emission for Parallel Planes with Vias in Packaging

Modeling Multilayer Power/ground Planes in Printed Circuit Boards and Electronic Packages Using Microwave Networks

Emission and Susceptibility Modeling of Finite-Size Power-Ground Planes Using a Hybrid Integral Equation Method

Electrical performance simulation of inhomogeneous multilayer LTCC structure by hybrid method

An Efficient Method for Power Integrity and EMI Analysis of Irregular-Shaped Power/Ground Planes in Packages

Efficient Analysis for Multilayer Power-Ground Planes with Multiple Vias and Signal Traces in an Advanced Electronic Package

An Efficient Method for Power Integrity and Emi Analysis of Advanced Packages

Modeling and analysis for EBG structure of power planes by using equivalent circuit method

Quantification of EMI for Power-Ground Plane and Novel EBG Structure for SSN Suppression

A Novel Combined Equivalent Networks Analysis for Power and Ground Planes with Narrow Slots

A Hybrid Schatten P -Norm and Lp -Norm with Plane Wave Expansion Method for Near–Near Field Transformation

Modelling Of Planar Ebg Structure By Using Equivalent Circuit Method

Prediction Of Pcb Radiated Emission In Shielding Cavity Using Equivalent Dipole Modeling

Solving the Scattering of Combined Conductor-Dielectric Bodies Based on EPA