Abstract:Using the complex image method (CIM), we have analyzed the frequency and temperature dependencies of substrate eddy currents for single-ended and differential spiral inductors on a lossy silicon substrate. From our analysis, we have derived a set of accurate closed-form expressions for calculating inductances and substrate losses due to substrate eddy currents. Here, we propose a frequency-dependent eleven-element equivalent circuit model based on these formulas. We established the validity of the model by comparing the simulated and measured results, which are in good agreement. Index Terms—Complex image method (CIM), differential inductor, eddy currents, greenhouse algorithm, inductor model. HE high operating frequencies, at which deep submicrom- eter and nano-scale CMOS devices are able to operate, have brought radio-frequency integrated circuits (RFICs) in the realm of CMOS making the quality factor of the on-chip spiral inductors a focus of intense research. The quality factor of the on-chip inductor is limited by the losses due to the finite conduc- tivity of the metal and the conducting silicon substrate. Non-per- fect metal wires used to form spiral inductors cause ohmic loss due to the non-zero resistance at low frequencies. Additionally the non-uniform current distribution in metal wires at high fre- quencies increases the losses and degrades the quality factor of inductors. This loss mechanism has been extensively studied as skin- and proximity-effect (1)-(12).

Enhancement of quality factor in RF-MEMS spiral inductors by etching out substrate

Analysis of Frequency- and Temperature-Dependent Substrate Eddy Currents in On-Chip Spiral Inductors Using the Complex Image Method

A derived circuit model for spiral inductors on lossy silicon substrate

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Analysis of 3D-Substrate Coupling in RF- MEMS Inductors by Extended PEEC

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A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

Electromagnetic-Thermal Analysis for Inductances and Eddy Current Losses of On-chip Spiral Inductors on Lossy Silicon Substrate

Quasi-Static Derived Physically Expressive Circuit Model for Lossy Integrated RF Passives

Model Description and Parameter Extraction of On-Chip Spiral Inductors for MMICs

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Physical Models of Planar Spiral Inductor Integrated on the High-Resistivity and Trap-Rich Silicon-on-Insulator Substrates

Calculation of RF-MEMS Inductors Using Partial Element Equivalent Circuits

High Q-factor CMOS-MEMS inductor

Accurate Model for Micromachined Microwave Planar Spiral Inductors

Substrate engineering of inductors on SOI for improvement of Q-factor and application in LNA

A Novel Local-Dielectric-Thickening Technique for Performance Improvements of Spiral Inductors on Si Substrates

The Enhancement Of Q-Factor Of Planar Spiral Inductor With Low-Temperature Annealing

Modeling and Simulation of Spiral Inductors in Wafer Level Packaged RF/Wireless Chips

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Backside Growth Thick Porous Silicon Layers for High Q On-Chip Rf Integrated Inductors