Characteristics Of Residual Stresses In Ti-N Films Coated By Plasma Enhanced Chemical Vapor Deposition

Kewei Xu,Shengli Ma,Vincent Ji
2000-01-01
Abstract:Residual stresses in TiN films were investigated with Xray diffraction. It was evident that to some extent the residual stress could be used as a merit to indicate changes of microstructure and mechanical properties. Both stress-free lattice spacing and adhesion of the films measured by X-ray diffraction and indentation scratch respectively keep apparently linear dependence upon the residual stress. The TiN films processed in the industrial-scale pulsed d.c. plasma enhanced CVD facility involved surprisingly much smaller stresses as compared to those deposited in conventional laboratory-scale chamber with simple d.c. power supply.
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