Abstract:The residual stress plays a vital role in determination of the device performance that uses thin films coating and thus the accurate determination of stress and its optimization with process parameters is an ongoing research work for many decades. In line with this, the microscopic origin of the stress at the atomic scale and its development during the thin film deposition is a matter of major scientific interests. The development of stress is a complex phenomenon and has a complex dependence to process parameters, film microstructure and its morphology. In this work, by utilizing a custom-designed cathodic arc deposition system and synchrotron radiation based 2D x-ray diffraction (XRD) technique, we determine the real-time evolution of stress, crystallite sizes and their preferential orientations of Aluminum-Titanium-Nitride (AlxTi1-xN) films with varied Al-content (x=0.0, 0.25, 0.50, and 0.67) on Si-100 substrate. The energies of incoming ions and hence stress in the films is tuned by applying different direct current substrate bias (Vs = floating potential, -20, -40, -60, -80, and -100 V). The instantaneous stress is evaluated by the well-known d vs. sin2{\psi} technique, while crystallite sizes are determined by analyzing line profiles of x-ray diffractograms. The evolution of stress and crystallite sizes are modelled with multiple numerical models from which kinetic parameters associated with the thin film depositions are extracted. The ex-situ microstructure characterizations of AlxTi1-xN coatings are carried out by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The formation of ex-situ microstructure of the films is discussed considering the results obtained from in-situ XRD data. Finally, we demonstrate that the method utilized here is a powerful approach towards estimation of the fracture toughness of thin film coatings.

Thermal Effects Of Residual Macrostress And Microstrain In Plasma-Assisted Cvd Tin Films

Characteristics Of Residual Stresses In Ti-N Films Coated By Plasma Enhanced Chemical Vapor Deposition

X-ray Evaluation on Residual Stresses in Vapor-Deposited Hard Coatings

Film thickness effect on texture and residual stress sign transition in sputtered TiN thin films

Effects of Residual Stress on the Mechanical Properties of Plasma-Sprayed Thermal Barrier Coatings

Effect of Temperature on Residual Stress and Mechanical Properties of Ti Films Prepared by Both Ion Implantation and Ion Beam Assisted Deposition

Microstructure And Mechanical Properties Of Plasma Assisted Cvd Ti(C,N) Films As A Function Of Carbon Content

Fluctuation Characteristics of Thermal Residual Stresses in AlTiN Coating: Based on Film/substrate Interface Microstructure and Morphology

Strain-induced Multiscale Structural Changes in Lamellar Thermal Barrier Coatings

Study on residual stress of multi-layered Au/NiCr/Ta films in microwave integrated circuits (MIC)

Residual Stress Of Tini Shape Memory Alloy Thin Films On Silicon Substrate

Effect of Thermal Stresses on the Microstructure of the Continuous Cooling TiAl Alloys

Stress variation with temperature/time and its correlation to film structure and deposition parameters

Microstructure, residual stress, and fracture of sputtered TiN films

Effect of Stress State of Different Tin Films on Their Tribological Behavior

Effects of Substrate Temperature on the Structure, Residual Stress and Nanohardness of Ti6Al4V Films Prepared by Magnetron Sputtering

In-situ real-time evolution of intrinsic stresses and microstructure during growth of cathodic arc deposited (Al,Ti)N coatings

Experimental Investigation of Residual Thermal Stress in Thermal Barrier Coating (Tbc)

Study on the residual stresses of Ti(C,N) coated WC cutting tools by pulsed high energy density plasma gun

Effect of As-Deposited Residual Stress on Transition Temperature of VO2 Films