Thermal Sintering Matchability between LTCC Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition
Meihui Xiao,Lan Zhang,Jiali Li,Lin Chen,Jun Sun,Kun Hu,Yi Gong,Jianjun Ding,Yongxing Lin,Xiangyang Li,Gang Liu,Xian Zhang,Xingyou Tian
DOI: https://doi.org/10.1002/adem.202301901
IF: 3.6
2024-03-03
Advanced Engineering Materials
Abstract:Low‐temperature co‐fired ceramic(LTCC) materials are a promising material for heat dissipation substrates due to their excellent thermal conductivity and thermal expansion coefficient similar to that of silicon. However, the difficulties in surface metallization techniques limit its application. This work uses Bi‐B‐Si‐Zn‐Al glass/ceramic composite as the substrate and Bi‐B‐Si‐Zn‐Al glass powder as the inorganic binder for silver pastes. The silver thick film with a glass content of 3 wt% is sintered at 800 °C for 30 min, and the samples have excellent electrical conductivity (surface square resistance of 0.29 mΩ/□) and mechanical properties (interface bonding force of 17.56 MPa). In addition, the introduction of CuO into the glass phase can inhibit the silver diffusion phenomenon during the sintering process and improve the conductive performance of the material. The results are beneficial for the preparation and application stability of LTCC devices. This article is protected by copyright. All rights reserved.
materials science, multidisciplinary