Abstract:Ceramic electronics have the advantages of large ampacity, high thermal conductivity, and excellent dielectric properties which are widely used in power electronics, optoelectronics, automotive industry, and aerospace technology. This work proposes a multimaterial dispensing additive manufacturing technology for customizing the 3D low‐temperature‐cofired ceramic (LTCC) circuitry. Customized LTCC aqueous slurry is first developed and then 3D printed together with commercial silver paste to build the green body. Then, the green body is debinded and sintered with a three‐stage process at 200, 500, and 850 °C, respectively. The shrinkage rate in 3D is around 17% which is comparable with commercial LTCCs. The surface quality of the sintered ceramic is improved obviously compared with that of the green body due to the glazing effect of the glass phase. For the silver conductor, the resistivity and the temperature coefficient of resistance are 2.34 ± 0.04 µΩ cm and 3.56 × 10−3 °C−1, respectively. A serial of demonstrators including 2D, 3D light‐emitting diode ceramic circuit boards and a ceramic heater/thermometer is developed to prove the potential and feasibility of the proposed technology. A novel multimaterial dispensing additive manufacturing technology and special low‐temperature‐cofired ceramic aqueous slurry are developed for the integrated manufacturing of customized 3D ceramic electronics. A series of ceramic electronics such as circuit boards, heater, and thermometer are fabricated to prove feasibility of this technology.

Research of LTCC Technology of Silver-Base Multilayer AIN Ceramic Substrates

Preparation and microwave dielectric properties of multilayer Li 1.075 Nb 0.625 Ti 0.45 O 3 co-fired ceramics with aqueous tape casting

Research of LTCC/Cu, Ag Multilayer Substrate in Microelectronic Packaging

Research on Copper Circuit Metalization of LTCC in N2 Atmosphere

Mechanism and Controlling of Silver Migration in Cofired Multilayer Devices with Ag-Pd Inner Electrodes

Thermal Sintering Matchability between LTCC Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition

Co-firing of LNT/Ag Multilayer Sheets Prepared by Aqueous Tape Casting

Effect of AlN Addition on Phase Formation in the LTCC with Al2O3/AlN Biphasic Ceramics Based on BBSZ Glass

The Co-Fired Behaviors Between Ag and Glass–ceramics Materials in LTCC

Effects of Organic Vehicle on the Rheological and Screen-Printing Characteristics of Silver Paste for LTCC Thick Film Electrodes

Progress in Research on Adjusting the Co-fireability of Different Materials for LTCC

A Silver‐palladium Thick Film for Aluminum Nitride Substrate

Thermal Sintering Matchability Between Low‐Temperature Cofired Ceramic Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition

Effect of Interactions at the Cofired Interface of Electrode/Ceramics on the Reliability of Lead-Based Multilayer Ceramic Capacitors

Metallization development for AIN/W cofired substrate at low temperature

Thermal Conductivity of LTCC

Mixed Solvents in Multi-Layer Ceramic Capacitors (MLCC) Elec-Tronic Paste and Their Effects on the Properties of Organic Vehicle

Multimaterial Additive Manufacturing of LTCC Matrix and Silver Conductors for 3D Ceramic Electronics

Cu Metallization of LTCC Substrate by Co-Firing Process in N2 Atmosphere

Application and Research Progress of LTCC Materials

Research on BCB/Cu thin film multilayer interconnection technology based on LTCC substrate for Microsystem Integration