Ultra-Thin Metal-Silicide/Si Schottky Contacts Studied by Ballistic Electron Emission Microscopy

Guo-ping RU,Xin-ping QU,Shi-yang ZHU,Bing-zong Li
DOI: https://doi.org/10.3321/j.issn:0253-4177.2000.08.010
2000-01-01
Abstract:Ballistic Electron Emission Microscopy (BEEM) is a novel technique to study metal/semiconductor interface. The BEEM technique was used to study ultra-thin PtSi/Si and CoSi2/Si schottky contacts. The results are compared with those from current-voltage (I-V) and capacitance-voltage (C-V) techniques. For ultra-thin PtSi/n-Si diodes, the Si substrate is bombarded by Ar+ ions with different energy before metal deposition. The BEEM, I-V/C-V measurements of ultra-thin PtSi/n-Si diodes show that I-V/C-V results are strongly influenced by the considerable series resistance of the ultra-thin silicide layer; while the BEEM measurements will not and the true Schottky contact properties can be obtained. BEEM results show that the Schottky barrier height of PtSi/n-Si decreases with the increase of the Ar+ ion bombardment energy. BEEM and variable-temperature I-V measurements of an ultra-thin CoSi2n-Si Schottky diode show that Schottky barrier inhomogeneity can be inferred from variable-temperature I-V results and depends on the model for the barrier height distribution; on the contrary a schottky barrier height distribution can be obtained directly by BEEM technique. The distribution of SBH is nearly the Gaussian distribution.
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