Microfabrication of MEMS Alkali Metal Vapor Cells for Chip-Scale Atomic Devices

YOU Zheng,MA Bo,RUAN Yong,CHEN Shuo,ZHANG Gao-fei
DOI: https://doi.org/10.3788/ope.20132106.1440
2013-01-01
Abstract:This paper reported on the microfabrication of alkali metal vapor cells based on the two-step low temperature anodic bonding for the chip-scale integration of atomic clock,atomic magnetometer,atomic gyroscope and other atomic devices.Cell structures were fabricated by Micro-electromechanical System(MEMS) bulk silicon process,and the etched silicon with cells was firstly bonded to Pyrex glass to fabricate preformed chambers by the standard anodic bonding process.Then,nitrogen buffer gas and micro-scale alkali metal(rubidium or cesium) were introduced into the preformed cells.The two-step anodic bonding process was used to seal the cells at a temperature lower than the paraffin flash point(198 ℃).In the first step,bonding voltage was lower than the breakdown voltage of nitrogen buffer gas to pre-seal the cells.In the second step,the bonding was in air atmosphere,and the bonding voltage increased up to 1 200 V to strengthen packaging quality.A high power laser system locally heated the micro-scale alkali metal packets to release alkali metal,and a uniform coating of paraffin was formed on cell walls to prolong the life of the polarized atoms.With proposed method,95% bonding is achieved by the two-step low temperature anodic bonding,and the alkali rubidium still has a metallic luster after anodic packaging.The achieved minimum volume of double-cells is about 6.5 mm×4.5 mm×2mm.Rubidium absorption spectrum shows that alkali rubidium is effectively encapsulated in the cells.It is feasible to fabricate MEMS alkali metal vapor cells by the two-step low temperature anodic bonding process.
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