Solidified Microstructure of SiCp/Al Composites Bonds under Ultrasonic Vibration and Their Fracture Characteristics

许志武,马星,马琳,闫久春,杨士勤,杜善义
DOI: https://doi.org/10.19476/j.ysxb.1004.0609.2013.01.010
2013-01-01
The Chinese Journal of Nonferrous Metals
Abstract:The microstructural characteristics of ultrasonic assisted fabricating bonds in SiCp/Al composites were investigated and the in-situ dynamic tensile process and the fracture surface at room temperature of the resultant bonds were observed by scanning electric microscopy (SEM). The results show that the bond microstructure can be effectively controlled by the application of ultrasonic vibration at different bonding stages. All the bonds rupture instantaneously under the tensile stress before obvious cracks are observed, which belong to a brittle fracture mode. When the bond is free of SiC particles, the flourishing Zn-Al eutectics are weak and serve as the crack sources and the main path of crack propagation. When SiC particles are present in the bond, which are transferred from the base metal and agglomerate in the Zn-Al eutectics, micro-crack initiates at the SiC/eutectics interface and mainly propagates along the Zn-Al eutectics, with a number of cleavage fracture of primary phase β(Zn) occurring in the crack propagation path under the rupture inertia. Primary phaseα(Al) has a significant role in crack resistance.
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