Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by A Bidirectional Bend Test

Yongkui Zhu,Zhiming Yu,Yunsong Niu,Wenjiang Ding

DOI: https://doi.org/10.1163/156856111x618461

IF: 2.431

2012-01-01

Journal of Adhesion Science and Technology

Abstract:Multilayered Cu coatings were successfully obtained by introducing periodic ultrasonic agitation into an ordinary electroplating process. A so-called bidirectional bending test technique was proposed to assess the adhesive performance of electroplated Cu coatings to a substrate, in which the coated sample was bent in two directions, while the changes in the coating surface were observed. The critical cycle number for the sample, which corresponds to the start of detachment of the coating from the substrate, proved to be suitable for assessing the adhesion. A comparative study showed that the multilayered Cu coatings produced in this work, had much better adhesion than did ordinary Cu coatings. (C) Koninklijke Brill NV, Leiden, 2012