Hydrogenation of Interface States at A Clean Grain Boundary in the Direct Silicon Bonded Wafer

Tingting Jiang,Xuegong Yu,Xin Gu,Deren Yang,George Rozgonyi
DOI: https://doi.org/10.1002/pssa.201127536
2012-01-01
Abstract:The effect of hydrogenation on the electrical property of a clean grain boundary (GB) in the p‐type direct silicon bonded (DSB) wafers has been investigated by current–voltage (I–V) and capacitance–voltage(C–V) deconvolution. It is found that compared to the as‐bonded GB, the energy distribution of interface states at the GB subjected to hydrogenation become shallower, and the hole capture cross‐section can be reduced by about two orders of magnitude, while the density of GB states changes only slightly. Therefore, a significantly smaller potential barrier of GB could be obtained after hydrogenation. These results are interesting for us to understand the mechanism of hydrogen passivation of GBs in photovoltaics.
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