Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array
Andri Schaufelbühl,N. Schneeberger,Ulrich Münch,Marc Waelti,Oliver Paul,Oliver Brand,Henry Baltes,Christian Menolfi,Qiuting Huang,Elko Doering,Markus Loepfe,A. Schaufelbuhl,U. Munch,M. Waelti,O. Paul,O. Brand,H. Baltes,C. Menolfi,E. Doering,M. Loepfe
DOI: https://doi.org/10.1109/84.967372
IF: 2.829
2001-01-01
Journal of Microelectromechanical Systems
Abstract:We present a micromachined 10 × 10 array of thermoelectric infrared sensors fabricated in a commercial complementary metal–oxide–semiconductor (CMOS) integrated circuit process with subsequent bulk-micromachining on wafer-scale. This array is used to demonstrate the feasibility of a low-cost thermal imager. The imager operates in ambient air, without thermal stabilization or cooling. The thermoelectric sensor principle allows one to measure dc radiation signals even without a radiation chopper. Each pixel contains an integrated heater, which allows calibration and self-testing of the imager. Addressing circuitry for the thermopiles and the heaters as well as a low-noise amplifier are integrated with the array on a single chip with a size of 5.5 × 6.2mm. The imager achieves a temperature resolution of 530mK with a low-cost polyethylene Fresnel lens. This performance allows application in presence detection, remote temperature measurement, and building control. $\hfill{\hbox{[572]}}$
engineering, electrical & electronic,nanoscience & nanotechnology,instruments & instrumentation,physics, applied