Investigation of One-Dimensional Thickness Scaling on $ \hbox{Cu/HfO}_{x}/\hbox{Pt}$ Resistive Switching Device Performance

Ming Wang,Hangbing Lv,Qi Liu,Yingtao Li,Zhongguang Xu,Shibing Long,Hongwei Xie,Kangwei Zhang,Xiaoyu Liu,Haitao Sun,Xiaoyi Yang,Ming Liu
DOI: https://doi.org/10.1109/LED.2012.2211563
IF: 4.8157
2012-01-01
IEEE Electron Device Letters
Abstract:Scaling is a key issue for resistive switching (RS) memory before commercialization. In this letter, we reveal the impact of electrode diffusion on the device performance as the thickness of RS material scaled. Serious deterioration of on/off ratio and device yield was observed when the material thickness scaled below 3 nm. A new method of two-step electrode deposition accompanied with reoxidizati...
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