Abstract:On-chip coupled inductors express huge nonuniform coupling tendencies, especially as frequency increases. This though desirable for wireless/galvanically isolated signal transfer but when mixed with the ground-signal-ground (GSG) pad could lead to a misrepresentative of the device's true coupling performance. To determine the coupling between the coupled inductors and that of the GSG pad an integrator analytical model investigating the total coupling effects of the GSG pad on laterally-coupled and stacked inductors is presented in this study. The model characterizes the lateral and vertical coupling effects using lumped circuit elements with analytical equations. The coupling effects of each component are further decomposed and analyzed as electrical, magnetic, and combined effects. The electrical coupling effect, particularly that of the GSG pad, increases with frequency and impacts significantly on the coupled inductors and the substrate. The mm-wave frequency characteristics such as skin and proximity effects of the inductors are also modeled by the double RL ladder network. The parameter extraction of the model is based on the measured S-parameter data. The validation of the proposed model given the measured scattering parameter S-21 dB achieves an RMSE of 0.0132 dB at 50 GHz. The inductor typology is most applicable to two-port networks for impedance matching, cross-coupled VCOs, and high-speed communication networks.

Multiple Coupling Inductors Model Based on Four-Port Measurement

Characterization and Modeling of Multiple Coupled Inductors Based on On-Chip Four-Port Measurement

Experimental Characterization of Coupling Effects Between Two On-Chip Neighboring Square Inductors

Model Description and Parameter Extraction of On-Chip Spiral Inductors for MMICs

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

An Improved Equivalent Circuit Model Based on the CMOS On-Chip Multiple Coupled Inductors from DC to Millimeter-Wave Region

Experimental Characterisation Of On-Chip Octagonal Double-Helix Inductors On Silicon Substrates

Analysis and Equivalent-Circuit Model for CMOS On-Chip Multiple Coupled Inductors in the Millimeter-Wave Region

Coupling Effects Between On-Chip Inductors in the Millimeter-Wave Regime

Vertical Topologies of Miniature Multispiral Stacked Inductors

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

Compact Equivalent Circuit Model Of Two-Layer Spiral Inductors

A Scalable Model of On-chip Inductor Including Tunable Dummy Metal Density Factor

Global Performance Evaluation of Various On-Chip Square Spiral Inductors on Gaas Substrates

A Novel Compact Model for On-Chip Vertically-Coiled Spiral Inductors

Comparative Characteristics of On-Chip Single- and Double-Level Square Inductors

Local scalable description of global characteristics of various on-chip asymmetrically octagonal inductors

Analysis of On-Chip GSG Pads Coupling Effects on Laterally-Coupled and Double-Stacked Inductors in the Millimeter-Wave Frequency Regime

Experimental Characterization of On-Chip Single and Double-Coupling Spiral Inductors

Design Optimization and Modeling of On-Chip RF Inductors in 0.13&#x00b5;m and 90nm Standard CMOS