Repeated Thermal Shock Behavior of the ZrB2–SiC–ZrC Ultrahigh-Temperature Ceramic

Fei Qi,Songhe Meng,Hao Guo
DOI: https://doi.org/10.1016/j.matdes.2011.09.007
IF: 9.417
2012-01-01
Materials & Design
Abstract:The one thermal cycle of the heating was carried out at maximal temperature of 1800±15°C in 5s using a resistance heating method with a large current and low voltage, and then the power supply was shut off and the specimen was naturally cooled to room temperature. According to the energy dispersive spectroscopy (EDS) analysis and scanning electron microscopy (SEM) observations, the surface microstructure of the specimen after the repeated thermal shock composed of: (1) a layer of SiO2-rich+ZrO2, (2) a layer of ZrO2+ZrB2 and (3) unoxidized substrate. The flexural strength of the specimen after the thermal shock of 10, 20 and 30cycles were 650MPa, 684MPa and 675MPa, respectively, which were obviously higher than the flexural strength of 580MPa before the thermal shock due to the formation of the SiO2-rich+ZrO2 layer and the compressive stress in the oxide layer. The flexural strength of the specimen after the thermal shock of 50cycles decreased to be 427MPa that was significantly lower than 580MPa before the thermal shock because of the presence of a large numbers of pores in oxide layer and through holes in the surface.
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