Thermal conductivity of porous silica films using modified polydimethylsiloxane and polyethyleneglycol as templates by sol–gel process

Dong Dong,Weidong Xue,Xiaobo Liu,Wei He,Wencheng Hu
DOI: https://doi.org/10.1016/j.micromeso.2011.02.006
IF: 5.876
2011-01-01
Microporous and Mesoporous Materials
Abstract:This paper reports the heat-resistant property of porous silica films synthesized using the sol–gel method. In the sol–gel system, a mixture solvent was adopted and side-chain polyether modified polydimethylsiloxane and polyethyleneglycol were introduced as the template and viscosity adjusting agent, respectively. Differential thermal analysis/thermogravimetric analysis, Fourier transform infrared spectroscopy, field emitted scanning electron microscope, and high-resolution transmission electron microscopy were employed to characterize the samples. Thermal conductivity measured by the 3ω method as functions of porosity, thickness, and annealing temperature was discussed in detail.
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