A study on the mechanical properties of epoxy resin film using the mark shearing system

Tao Hua,Huimin Xie,Zhanwei Liu,Jiangfan Zhou,Fulong Dai,Pengwan Chen,Qingming Zhang

DOI: https://doi.org/10.1016/j.polymertesting.2009.08.008

IF: 5.1

2010-01-01

Polymer Testing

Abstract:An epoxy resin was chosen as the substrate of a grating for a curved surface moiré interferometry study because of its chemical properties and convenience in processing. Considering the low toughness of the epoxy resin, di-n-butyl was used to modify the resin's mechanical properties. A number of films with different amounts of di-n-butyl and undergoing differing lengths of time in the centrifuge were made. The mechanical properties of these films were then studied. A loading apparatus driven by a step motor was used to apply a load and an optical extensometer, based on the mark shearing method, was used to measure the strain of the film. The nominal stress–strain curves of these films were obtained which yielded useful results. The experimental results also demonstrated the feasibility of the testing system for film-like specimen measurements.