Abstract:In spite of a high market share of plastic IC packaging, there are still reliability issues, especially for the effects of moisture. The mechanism between moisture and epoxy polymer is still obscure. A multi-step cross-linking approach was used to mimic the cross-linking process between the DGEBA resin and JEFFAMINE®-D230 agent. Based on the molecular dynamics method, the thermo-mechanical properties and microstructure of epoxy polymer were analyzed. In this paper, the degree of cross-linking ranged from 0% to 85.4% and the moisture concentration ranged from 0 wt.% to 12 wt.%. The hydrogen bonds were investigated in the moisture invaded epoxy polymer. Although most of the hydrogen bonds were related to water molecules, the hydrogen bonds between the inside of epoxy polymer were reduced only a little as the concentration of moisture increased. The diffusion coefficient of the water molecules was found to increase with the increase of moisture concentration. When the moisture concentration was larger than 12 wt.% or smaller than 1.6 wt.%, the diffusion coefficient was less affected by the epoxy polymer. In addition, the free volume and the thermal conductivity of the epoxy polymer were considered. It was found that the moisture could increase the thermal conductivity from 0.24 to 0.31 W/m/K, identifying a coupling relationship between moisture and thermal properties. Finally, the mechanical properties of epoxy polymer were analyzed by uniaxial tensile simulation. The COMPASS and DREIDING force fields were used during the uniaxial tensile simulation. A better result was achieved from the DREIDING force field compared with the experiment. The degree of cross-linking was positively correlated with mechanical properties. For the system with the largest degree of cross-linking of 85.4%, the Young’s modulus was 2.134 ± 0.522 GPa and the yield strength was 0.081 ± 0.01 GPa. There were both plasticizing and anti-plasticizing effects when the water molecules entered the epoxy polymer. Both the Young’s moduli and yield strength varied in a large range from 1.38 to 2.344 GPa and from 0.062 to 0.128 GPa, respectively.

Characterization of moisture effect on static and fatigue performance of epoxy resin using thin-film specimen on dynamic mechanical analyzer

Moisture absorption process of epoxy resin and mechanical properties of its fiber composites

Synergistic effect of cyclic mechanical loading and moisture absorption on the bending fatigue performance of carbon/epoxy composites

Effect of Hygrothermal Environment on Tensile Properties of Carbon Fiber Epoxy Resin Composites

Moisture sorption–desorption–resorption characteristics and its effect on the mechanical behavior of the epoxy system

Effect of Moisture Absorption on the Bending Fatigue Performance of Carbon/Epoxy Laminates

Molecular Dynamics Investigation of the Thermo-Mechanical Properties of the Moisture Invaded and Cross-Linked Epoxy System

Influence of Humidity on Fatigue Performance of CFRP: A Molecular Simulation

Moisture effect on the mechanical and interfacial properties of epoxy-bonded material system: An atomistic and experimental investigation

Chemical, mechanical and morphological investigation on the hygrothermal aging mechanism of a toughened epoxy

Understanding moisture effect on nonlinear vibrations of epoxy thin film via a multiscale simulation

Effects of Moisture Ingress on the Mesoscale Mechanical Properties of Epoxy Adhesives under Elevated Temperature

Investigation of the Effect of Hygrothermal Conditions on Epoxy System by Fractography and Computer Simulation

Characterization and modeling of the polymerization-dependent moisture absorption behavior of an epoxy-carbon fiber-reinforced composite material

Moisture Absorption/Desorption Effects on Flexural Property of Glass-Fiber-Reinforced Polyester Laminates: Three-Point Bending Test and Coupled Hygro-Mechanical Finite Element Analysis

Effects of Moisture Ingress on the Bond Between Carbon Fiber and Epoxy Resin Investigated with Molecular Dynamics Simulation

The Effect of Hygrothermal Aging on the Properties of Epoxy Resin

Qualitative Separation of the Effect of Voids on the Static Mechanical Properties of Hygrothermally Conditioned Carbon/epoxy Composites

Effect of Moisture Absorption on the Bending Strength of Carbon/Epoxy Composites with Voids

Qualitative Separation of the Effect of Voids on the Bending Fatigue Performance of Hygrothermal Conditioned Carbon/Epoxy Composites

An investigation of hygrothermal effects on adhesive materials and double lap shear joints of CFRP composite laminates