Polyimide/polyoxometalate copolymer thin films: synthesis, thermal and dielectric properties

Lin Tan,Shumei Liu,Fang Zeng,Zhiyuan Ling,Jianqing Zhao
DOI: https://doi.org/10.1002/pat.1454
IF: 3.348
2010-01-01
Polymers for Advanced Technologies
Abstract:A mono-lancunary keggin-type decatungstosilicate (SiW11) polyoxometalate (POM) modified by gamma-aminopropyltriethoxysilane (KH550) was incorporated into polyimide (PI) through copolymerization. Nuclear magnetic resonance (NMR), fourier transition infrared spectroscopy (FTIR), and wide angle X-ray diffraction (WAXD) were used to characterize the structure and composition of the polyoxometalate-organosilane hybrid (SiW(11)KH550) and PI/SiW(11)KH550 copolymers. The differential scanning calorimetry (DSC) studies indicate that the glass transition temperature (T-g) of PI/SiW(11)KH550 copolymers increases from 330 degrees C (for neat PI) to 409 degrees C (for the copolymer sample with 10 wt% of SiW(11)KH550). Dielectric measurement showed that both the dielectric constant and the dielectric loss for the copolymer thin films decreased with the increase in SiW(11)KH550 content, and the dielectric constant and dielectric loss values decreased to 2.1 and 3.54 X 10(-3), respectively, for the copolymer sample with 10 wt% of SiW(11)KH550. The incorporation of SiW(11)KH550 into polymer matrices is a promising approach to prepare PI films with a low dielectric constant and low dielectric loss. Copyright (C) 2009 John Wiley & Sons, Ltd.
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