Annealing effects in silicon implanted with helium

Bingsheng Li,Chonghong Zhang,Lihong Zhou,Yitao Yang,Honghua Zhang
DOI: https://doi.org/10.1016/j.nimb.2008.09.016
2008-01-01
Abstract:Silicon samples were implanted with helium and analyzed by atomic force microscopy (AFM) and Raman spectroscopy before and after annealing in the range of 523–1273K. After annealing at 523K, the amorphous area induced by He-ion implantation at room temperature was partially recovered and grain sizes became larger. The surface morphology was analyzed through AFM measurements and it was observed that root mean square of the surface roughness alters upwards and then downwards with annealing temperature.
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