Evaluation of Residual Stress in Lead Frame Copper Strips by Nanoindentation
Cao Taifeng,Su Peng,Xu Zhiheng,Feng Zeqiang,Wang Shaohua,Qiao Junwei
DOI: https://doi.org/10.1007/s10853-023-08367-w
IF: 4.5
2023-01-01
Journal of Materials Science
Abstract:Residual stress greatly influences the warping behavior of lead frame copper alloys and can be evaluated by nanoindentation. In this study, the residual stresses are calculated by Suresh’s model, Wang’s model, and Ghanbari’s model. In addition, an elastic work model, based on indentation unloading curve, is proposed. The results reveal that the residual stresses of all samples are determined to be compressive stresses. Furthermore, Wang’s model and the elastic work model may be considered to be most appropriative for the residual stress assessments in lead frame copper strips. More importantly, for the lead frame copper alloys, there will be an obvious pile-up effect during the indentation process. This effect is utilized to correct residual stresses in Suresh’s model, and identified that residual stresses decrease by about 300 MPa. This study has great significance for the development of the residual stress models by nanoindentation.