Influence of Stress on the Performance of PZT Thin Films for Microphone Application

NX Zhang,Y Yang,XM Wu,TL Ren,LT Liu
DOI: https://doi.org/10.1080/10584580590899270
2005-01-01
Integrated Ferroelectrics
Abstract:A series of microphone cells based on integrated PZT thin films were fabricated by typical MEMS process. The thickness of back silicon as a load of the vibrating diaphragm was controlled by changing ICP (Inductive Coupling Plasma) etching time and power. Concaved diaphragms with different radius were formed due to the balanced tensile stress among the multi-layer films structure.. The remnent and saturated polarization strength of microphone cells decreased with the increased deformation of diaphragm. The phenomenon was explained as the weakening of mechanical-electrical coupling in piezoelectric thin films in stressed state.
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