Abstract:With the current explosive growth of communication technologies and a wide variety of applications being found for broadband and high frequency of electronic components, LTCC (Low Temperature Cofired Ceramics and Ferrites) with materials that possess special characteristics have been rapidly developed, due to its greater multifunctionality, higher performances, sub-miniaturization and excellent reliability. As one of the most important passive components, the chip inductor with high inductances used in high frequency has attracted significant interests in 3-D miniaturized systems. This paper focuses on the design and fabrication of a chip inductor based on the ZnTi-substituted hexaferrite BaFe12O19 by LTCC technology to realize the 0805 size of standard packaging for high frequency applications. Testing results show that the value of inductor is 2.45uH and cut-off frequency is 548MHz. And the measured results agree with the simulated data basically, which indicates that the samples can satisfy the need of high frequency inductors. The influences of each factor on the performances of inductor are also analyzed. It is an effective method to resolve the consistency problems between simulation and manufacture.

High-frequency Micro-Inductor Fabricated on NiCuZn Ferrite Substrates

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Ni-Zn Ferrite-Powder-Mixed-Photoresist Coated On-Chip RF Inductor

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Ferrite-Integrated On-Chip Inductors for Rf Ics

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Ferrite-Partially-Filled On-Chip RF Inductor Fabricated Using Low-Temperature Nano-Powder-Mixed-Photoresist Filling Technique for Standard CMOS

A RF Integrated Inductor with CoZrO Ferrite Thin Film

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Characteristics of Double Planar Thin Film Inductor with Ni-based Magnetic Film for DC/DC Integration

Micromachined Inductor Integrated with a Patterned Soft Magnetic Thin Film

Ferrite-integrated On-Chip RF Solenoid Inductor

Preparation and electromagnetic properties of NiCuZn ferrites and multilayer chip inductors