Anelastic grain-boundary relaxation arising from solid solution of chromium in polycrystalline Al2O3

Ken'ichi Ota,Giuseppe Pezzotti
DOI: https://doi.org/10.1016/1359-6462(95)00677-X
IF: 6.302
1996-01-01
Scripta Materialia
Abstract:A new etching method for a single-crystalline Al2O3 (100) film grown on Si (100) by chemical-vapour deposition (CVD) and a sapphire wafer is proposed for the first time using Si ion implantation and HF chemical etchant to develop potential applications of the silicon on insulator (SOI) structure. Line and space patterns of resist are transferred to sharp Al2O3 and Si patterns. The etch rate is 100 Å min−1 under implanted conditions of 80 kV and 3 × 1015 cm−2 for 0.1 μm thick Al2O3. The implanted Al2O3 surfaces are investigated by secondary ion mass spectroscopy (SIMS) and X-ray photoelectron spectroscopy (XPS). The change of the surface structure from Al2O3 to Al2O3 · SiO2 (aluminosilicate) is the dominant reason for this etching rather than a surface-damage effect caused by implantation.
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