Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

Microstructures and Nano Mechanical Properties of the Metal Tungsten Film

Microstructure and Mechanical Properties of Nanocrystalline Tungsten Thin Films

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

The Influence of Crystal Defects on the Elastic Properties of Tungsten Metals

Nanoindentation studies of Cu–W alloy films prepared by magnetron sputtering

Elemental distribution and fracture properties of magnetron sputtered carbon supersaturated tungsten films

In situ observation of intergranular fracture propagation in nanocrystalline freestanding ultrathin tungsten film

The Surface Mapping and Crystal Orientation of Body-Centered Cubic Thin Metal Tungsten Films of Different Thickness

Enhanced Tensile Ductility of Tungsten Microwires Via High-Density Dislocations and Reduced Grain Boundaries

The Nano Tungsten Thin Film and its Contacting Property with Aluminium Electrodes

Influence of W content on microstructure and surface morphology of hard Ni-W films fabricated by magnetron co-sputtering

Mechanical Properties of Tungsten Doped Amorphous Hydrogenated Carbon Films Prepared by Tungsten Plasma Immersion Ion Implantation

Microstructure and stress evolution of W nanofilms prepared by arc ion plating under different deposition time and substrate bias

Composition, Residual Stress, and Structural Properties of Thin Tungsten Nitride Films Deposited by Reactive Magnetron Sputtering

Mechanical Behavior and Dynamic Failure of High-Strength Ultrafine Grained Tungsten under Uniaxial Compression

Insights into the Nucleation, Grain Growth and Phase Transformation Behaviours of Sputtered Metastable Β-W Films

Electrical and Mechanical Characterization of Chemical Vapor Deposition of Tungsten on Sputter-Deposited TiN Layers

Insight into the Microstructure and Tensile Behavior of the W–Cu Composite Reinforced with Tungsten Fibers and Particulates

Size dependent mechanical properties and deformation mechanisms in Ti and Zr films

Microstructure and mechanical properties of nano dual-phase TiCuNi metallic glass films achieved by modulating magnetron sputtering temperature

Effect of tungsten micro-scale dispersed particles on the microstructure and mechanical properties of Ti–6Al–4V alloy