Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

The Nano Tungsten Thin Film and its Contacting Property with Aluminium Electrodes

Microstructures and Nano Mechanical Properties of the Metal Tungsten Film

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

The Characterization of Superconducting Tungsten Thin Films Deposited by DC Magnetron Sputtering

J212025 Fabrication of Nanowire Surface Fastener on Flexible Substrate and Its Electrical and Mechanical Properties

Microstructure and Mechanical Properties of Nanocrystalline Tungsten Thin Films

Preparation and Properties of Textured Ni–W Coatings Electrodeposited on the Steel Surface from a Pyrophosphate Bath

T0301-1-1 Fabrication of Au Nanowire Utilizing Porous Aluminum

Study of Tungsten Deposited on Amorphous Si, Si (111) and Sio2 Using Direct-Current Magnetron Sputtering

Structure and Properties of Electrocodeposited Cu-Al2o3 Nanocomposite Thin Films

Effect of Tungsten on Microstructures of Annealed Electrodeposited Ni-W Alloy and Its Corrosion Resistance

Microstructure and Electrochemical Characterization of Ti–Al–C–N Coatings As Biological Dry Electrodes

Electrical and Mechanical Characterization of Chemical Vapor Deposition of Tungsten on Sputter-Deposited TiN Layers

Template-induced Formation of Α-W and Size-Dependent Properties of Tungsten Thin Films

Enhanced structural, optical and electrical properties of polycrystalline WO 3 thin films achieved by aluminum nanosheets coating

Annealing Effect on the Contact Angle, Surface Energy, Electric Property, and Nanomechanical Characteristics of Co40Fe40W20 Thin Films

Electrocatalytic Properties of Nano-Crystalline Tungsten Carbide Thin Film Electrode for Nitromethane Electroreduction

Microstructural and Electrical Resistivity of TiN Electrode Films Prepared by Direct Current (DC) Reactive Magnetron Sputtering

Microstructural and electrical behavior of NiCr/Al nanomultilayered films prepared by magnetron sputtering

Electrodepositing amorphous Ni-W alloys for MEMS

Tunable Wettability of Metallic Films with Assistance of Porous Anodic Aluminum Oxide