J212025 Fabrication of Nanowire Surface Fastener on Flexible Substrate and Its Electrical and Mechanical Properties

Keita UCHIDA,Yang JU
DOI: https://doi.org/10.1299/jsmemecj.2013._j212025-1
2013-01-01
Abstract:The characteristic of nanowire is gradually attracting many researchers with the potential applications of nano devices, nano sensors, solar sells and so on. This paper describes fabrication and evaluation of high density Cu nanowire array grown in anodic aluminum oxide (AAO) template. To fabricate high density nanowire array, at first Au films with the thickness of 100 nm was evaporated on one side of AAO template as a conductive working electrode. Nanowire array was formed via electro deposition under a constant current of 0.001 A approximately in copper sulfate aqueous solution at room temperature. After etching in 3 M NaOH aqueous solution for 30min to remove porous aluminum, we obtained high density nanowire array perpendicular to PDMS substrate. High density Cu nanowire arrays with diameters of 80 nm, approximately, were observed by scanning electron microscope. In order to understand the performances of Cu nanowire array, the electrical and mechanical properties of them were studied in details. As a result, the shear adhesion was 8.2 kPa, and the electrical resistance was 7.0Ω・cm^2.
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