Improvement of Adhesive Strength of Nanowire Surface Fastener by the Optimization of Diameter Ratio of Nanowires

Motohiro KATO,Yuhki TOKU,Yasuyuki MORITA,Yang JU
DOI: https://doi.org/10.1299/jsmemecj.2017.j0330303
2017-01-01
Abstract:Lead-free solder has been used for surface mounting of electronic devices in consideration of the environment. However, there is a concern that the electronic parts may be damaged by heating during bonding because the lead-free solder has a high melting point. Therefore, development of a new bonding technique without heating is required. There are many studies on nanowires because of their unique characteristics which are different from bulk materials. In this paper, we fabricated Cu nanowire surface fasteners and investigated the improvement of strength by changing the diameter ratio of nanowires. Cr and Au films were formed as electrodes on glass substrates by sputtering. According to the template method, the polycarbonate template was fixed on one electrode to fabricate Cu nanowires by electrodepositing in the CuSO4·5H2O solution. After removing the template by etching with dichloromethane, the Cu nanowire surface fastener was fabricated. By applying a preload, the Cu nanowire surface fasteners were connected. Thereafter, the adhesion strength of the Cu nanowire surface fastener was evaluated by a tensile test. The highest bonding strength was found to be 162.6 N/cm2 while the combination of the nanowire array with the diameter ratio of 1:4. Nanowires intertangling with each other was assumed to be an additional effect on the van der Waals force between nanowires.
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