Abstract:A novel method of patterning high precision copper conductive micropatterns on flexible polymer substrate (polyimide) is developed. We utilized the coordination effect between palladium salts and pyridine structures to fix the palladium chloride (PdCl2) on the surface of polymer film while the 2,6-dimethylpyridine structures formed in the specific areas under ultraviolet light guaranteed the resolution of final patterns. Simultaneous thermal reduction of PdCl2 on the surface can be achieved in the process of thermal cyclization of the polymer substrate. As a consequence, the obtained polyimide (PI) film can be patterned with conductive copper micropatterns directly by electroless plating. In particular, we accomplished the deposition of high precision copper pattern with a minimum line width of 50 µm and minimum line spacing of 20 µm on PI thin films (thickness ∼10 µm) by electroless plating. The prepared conductive copper micropatterns exhibit a low resistivity of 1.78 µΩ·cm the same as the pure block copper. And the relationship between the structures of the polymer chains and the physical properties of polymer substrates, such as the dimensional stability, mechanical and dielectric properties were also discussed in detail. This simple and novel method of patterning metal on the polymer surface does not need to achieve the catalytic metal adhesion required for electroless plating at the cost of destroying the substrate surface and avoiding the introduction of unstable interlayers. This patterning method is compatible with the current roll-to-roll production process and can be used to develop high-performance micro-integrated circuits.

Molecular Self-Assembly Combined with Electroless Copper Plating of Laser-Induced Patterning on Polyimide Film

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

Laser-induced site-selective silver seeding on polyimide for electroless copper plating

Region-selective electroless gold plating on polycarbonate sheets by UV-patterning in combination with silver activating

Selective electroless deposition of copper on polyimide surface by microcontact printing

Palladium-assisted Metal Patterning on Polyimide Surfaces

Laser Direct Activation of Polyimide for Selective Electroless Plating of Flexible Conductive Patterns

Metal Conductive Surface Patterning on Photoactive Polyimide

Application of Polyvmylpyrrolidone/AgNO_3,Colloid in LaserInduced Patterned Electroless Copper Plating

Selective‐area electroless copper plating on polyimide employing laser patterning of a catalytic film

Selective Silver Seeding on Laser Modified Polyimide for Electroless Copper Plating

A Bio-Inspired Method to Inkjet-Printing Copper Pattern on Polyimide Substrate

Fabrication of Copper Patterns on Polydimethylsiloxane Through Laser-Induced Selective Metallization

Direct additive copper plating on polyimide surface with silver ammonia via plasma modification

Fabrication of metallic patterns on ordinary polymer substrates by laser direct activation and electroless plating

Fabrication of Conductive Copper Patterns Using Reactive Inkjet Printing Followed by Two-Step Electroless Plating

Modification of Cu Nanoparticles with A Disulfide for Polyimide Metallization

Fabricating Metallic Circuit Patterns on Polymer Substrates Through Laser and Selective Metallization.

Direct Surface In-Situ Activation for Electroless Deposition of Robust Conductive Copper Patterns on Polyimide Film

Selective Patterning of Conductive Silver on Polyimide Film by Localized Microplasma Reduction and Electroless Deposition

Single-step Selective Metallization on Insulating Substrates by Laser-Induced Molten Transfer