Laser Direct Activation of Polyimide for Selective Electroless Plating of Flexible Conductive Patterns

Jun Ren,Dongya Li,Yang Zhang,Wenzhen Yang,Heng-yong Nie,Yu Liu
DOI: https://doi.org/10.1021/acsaelm.1c01193
IF: 4.494
2022-04-01
ACS Applied Electronic Materials
Abstract:Flexible conductive patterns on polyimide substrates are attracting increasing research interest in the areas of wearables, biomedicals, automotives, and energy harvesters. This paper reports a laser-induced selective activation (LISA) process for electroless metallization and, therefore, the creation of complex conductive patterns on polyimide substrates. In this process, a Q-switched pulsed laser is utilized for scanning the surface and forming the catalytic layer consisting of microporous structures, which enhances the stability of electroless plated metallic structures on the polyimide surface and exhibits superior mechanical stability under repeated bending and harsh environments. The high resolution of the metallic patterning enables the demonstration of a copper microgrid pattern with a line width down to 50 μm. Moreover, flexible light-emitting diode displays and electromagnetic interference shielding films are successfully manufactured to indicate the promising capability of our LISA process.The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsaelm.1c01193.Schematics of the electroless copper plating process; photographs of the customized cyclical bending testing system; schematics and photographs of the customized high-throughput resistance meter; and photographs of the laser scanning system (PDF)Movie S1: Demonstration of the working devices and circuits (MP4)Movie S2: Demonstration of the designed circuits (MP4)Movie S3: Real-time fabrication process (MP4)This article has not yet been cited by other publications.
materials science, multidisciplinary,engineering, electrical & electronic
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