Shear Banding Deformation in Cu/Ta Nano-Multilayers

F. Wang,P. Huang,M. Xu,T. J. Lu,K. W. Xu
DOI: https://doi.org/10.1016/j.msea.2011.06.019
2011-01-01
Abstract:Nanoscale Cu/Ta multilayers with individual layer thickness ranging from 3 to 70 nm were deformed under nanoindentation at room temperature. Shear bands can be observed only when individual layer thickness is reduced to 9 nm or below, indicating formation of shear bands in the Cu/Ta multilayers is layer thickness dependent. By observing the cross sectional transmission electron microscope images of the indentation fabricated through focused ion beam technique, shear banding deformation causing a unique layer-morphology with prevalent mismatched laminate structure has been reported for the first time. By capturing and analyzing a series of typical indentation-induced deformed microstructures, a new physical mechanism of shear banding behavior in metallic nano-multilayers is suggested. (C) 2011 Elsevier B.V. All rights reserved.
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