Effect of pulsating current on the limiting current and deposit structure of a silver plating system

C.C. Tang,C.C. Wan
DOI: https://doi.org/10.1016/0254-0584(90)90138-Z
IF: 4.778
1990-01-01
Materials Chemistry and Physics
Abstract:Pulse current in the millisecond range was applied to a silver cyanide electroplating system. We found that the average limiting current (iav) under pluse current condition is lower than that under DC(idl) in dilute AgCN solution. However iav is larger than iav in concentrated AgCN solution, which shows the limitation of the previous theoretical prediction which is based on a pure convective mass transfer concept. Maximum microhardness of silver deposit can also be obtained by proper adjustment of the duration of ON cycle (ton) and OFF on cycle (toff). X-ray diffraction analysis also shows that pulse current favors the formation of the (111) orientation in silver.
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